Staff Engineer, Packaging

Company: Qualcomm
Location: San Diego
Posted on: April 1, 2025

Job Description:

Company:Qualcomm Technologies, Inc.Job Area:Engineering Group, Engineering Group > Packaging EngineeringGeneral Summary:Qualcomm Data Center team is developing high-performance, energy-efficient server solutions for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work!As a Staff EDA engineer in the advanced packaging space, you'll be at the forefront of hardware design, focusing on 2.5D/3D IC package design and analysis. Your role involves guiding design and EE teams to ensure alignment with the product roadmap and requirements. We're seeking a highly motivated EDA tool researcher and software developer with a semiconductor packaging background to drive new 2.5D and 3D packaging initiatives aligned with Qualcomm's roadmaps.Job Description:

• Develop, qualify, and certify 2.5D and 3D package EDA reference flows based on critical KPIs.
• Partner with EDA vendors, SOC Foundries, and packaging SAT houses to influence industry EDA roadmap to meet Qualcomm's product requirements.
• Collaborate with internal SOC and packaging design teams to define and deploy the reference flows.
• Develop and automate tools and methodology to accelerate package and system design, analysis, and verification processes.Minimum Qualifications:
  • Bachelor's degree in Engineering, Computer Science, or related field.
  • Development-level understanding of Chiplet driven packaging EDA reference flows and EDA landscape.
  • Tool development and automation experience for Cadence APD/SIP, Cadence Innovus, Cadence Virtuoso, Siemens Xpedition, Calibre DRC/LVS, etc.
  • Understanding of package design and SOC design flow from netlist creation to IC tape out and package tooling.
  • Self-motivated with the ability to solve complex problems.
  • Excellent verbal and written communication skills.Preferred Qualifications:
    • MS Electrical Engineering/Computer Science with 2+ years of relevant experience.
    • Knowledge of Package/PCB design and simulation flows and tools.
    • Experience in Cadence SIP/APD, Siemens Xpedition or other Package Design, Electrical or Thermal modeling EDA tools preferred.
    • Experience in front-end design tools like Cadence Virtuoso, Innovus.
    • Prior strong experience in RF/SI software applications like Cadence Sigrity, Siemens, Keysight, Agilent, Ansys, Dassault.
    • Exposure to circuit solvers such as Agilent ADS or AWR, full-wave EM solvers such as HFSS, Clarity, CST Microwave Studio, PowerSI or SIWave.
    • Writing scripts in SKILL/RAVEL, Tcl/Tk, VB, PERL, Python, Java, C# in a production environment, proficient with Unix/Linux OS, utilities, and scripting.
    • Leadership skills to help direct, prioritize, and clearly set project tasks per schedule.
    • Communicate milestones and directions to outside team members.Pay range and Other Compensation & Benefits:$154,000.00 - $231,000.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants. In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer.If you would like more information about this role, please contact .
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Keywords: Qualcomm, San Diego , Staff Engineer, Packaging, Engineering , San Diego, California